Die & Wafer Services

Die & Wafer Services

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Die & Wafer Services

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Based on global advanced SiC epitaxial technology, BASiC has independently developed series products of bare dies. At present, 650V and 1200V SiC Schottky Diode and 1200V SiC MOSFET bare dies and wafer have been developed.

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SiC Schottky Diode bare dies

Wafer Part No.Die Part No.VRRM

(V)

IF

(A)

BW3D04E065S2BD3D04E065S26504
BW3D06E065S2BD3D06E065S26506
BW3D08E065S2BD3D08E065S26508
BW3D10E065S2BD3D10E065S265010
BW3D20E065S2BD3D20E065S265020
BW3D30E065S2BD3D30E065S265030
BW3D40E065S2*BD3D40E065S2*65040
BW3D50E065S2*BD3D50E065S2*65050
BW3D03E120S2BD3D03E120S212003
BW3D05E120S2BD3D05E120S212005
BW3D10E120S2BD3D10E120S2120010
BW3D15E120S2BD3D15E120S2120015
BW3D20E120S2BD3D20E120S2120020
BW3D30E120S2BD3D30E120S2120030
BW3D40E120S2BD3D40E120S2120040
BW3D50E120S2BD3D50E120S2120050
BW3D40E200S2BD3D40E200S2200040


SiC MOSFET bare dies

Wafer Part No.Die Part No.

VDS

(V)

RDS(on)@Tj=25°C

(mΩ)

BW2M160A120SBD2M160A120S1200160
BW2M080A120SBD2M080A120S120080
BW2M065A120SBD2M065A120S120065
BW2M040A120SBD2M040A120S120040
BW2M030A120SBD2M030A120S120030
BW2M600A170SBD2M600A170S1700600