BASiC Semiconductor at NEPCON JAPAN, the International Electronics Exhibition

2024-02-29

Recently, the 38th NEPCON JAPAN, an international exhibition for electronic technologies, was held at the Tokyo Big Sight International Exhibition Center. BASiC Semiconductor brought its full range of automotive & industrial SiC power modules, SiC MOSFETs & diodes, gate drivers and driver ICs to this Asian electronics industry event, attracting many industry professionals to stop by for exchanges and negotiations.

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Overview of exhibits



Automotive SiC Power Modules

The automotive SiC power modules, exhibited by BASiC Semiconductor adopt advanced packaging technologies such as silver sintering, DTS+TCB (Die Top System + Thick Copper Bonding). They achieve convincing performance in parameters such as gate input capacitance, stray inductance and thermal resistance. They can strongly support automotive manufacturers to replace silicon with SiC in motor drives, significantly improve vehicle efficiency, and reduce manufacturing and usage costs.

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Industrial SiC Power Module

To better meet the high power density needs of industrial customers, BASiC Semiconductor introduces the industrial full SiC MOSFET power module Pcore™2 E2B. This product is designed based on a high-performance 6-inch wafer platform, demonstrating excellent performance in terms of on-resistance, switching loss, cross-talk immunity, and bipolar degradation immunity. The products can be widely used in high-power charging stations, fuel cell DCDC, UPS, high-frequency DCDC converters, high-end welding machines, photovoltaic inverters, etc.

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2nd-generation SiC MOSFETs

The 2nd-generation SiC MOSFETs from BASiC Semiconductor are developed on a 6-inch wafer platform and outperform its predecessor in terms of specific on-resistance (reduced by 40%), switching loss (reduced by 30%), and reliability. These improvements allow EVs, DC fast charging, solar & energy storage systems, industrialpower supplies, telecommunication power supplies etc. to achieve higher energy efficiency and reliability.

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Gate Drivers

For high-power, high-voltage power electronics applications, BASiC Semiconductor's subsidiary, BRONZE Technologies, has launched a series of gate drivers to provide different solutions for 650V~6500V power devices, which can be adapted to most of the power modules, including EconoDUAL, PrimePACK, 62mm, IHM, and crimp modules, and has functions such as desaturation detection protection for power devices, active clamping protection, Miller-clamp protection, logic interlocking, under-voltage protection, and gate short-circuit protection, to ensuring stable and reliable operation of the system.

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Gate Driver ICs

BASiC Semiconductor has developed gate driver ICs for a variety of applications, adaptable to different power devices. Our gate driver ICs include isolated driver ICs and low-side driver ICs, with insulation withstand voltage up to 8000V, drive current up to ±15A, supporting gate driver requirements for power devices with withstand voltage up to 1700V.   

The product has lower transmission delay, stronger interference immunity, high driving current, high reliability,which can be widely used in the fields of On-Board Charger (OBC), main and auxiliary motor drives of EVs, charging stations, solar & energy storage systems, industrial power supplies, UPS, commercial air-conditioning, etc.

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During the exhibition, Su Iwamoto, Director of the R&D Department of BASiC Semiconductor's Japanese subsidiary, delivered a technical speech.

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The local industry media EE Times Japan reported on BASiC Semiconductor's participation in the exhibition.

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At present, BASiC Semiconductor’s SiC power devices using self-developed bare dies have been shipped in morethan tens of millions units, the automotive power modules have been designated by nearly 20 vehicle OEMs and Tier1 motor controller vendors for over 30 vehicle models, making BASiC Semiconductor become one of the leading companies in the domestic mass production of SiC modules. In the future, BASiC Semiconductor will continue to plough into the wide bandgap semiconductor track, providing high-performance and high-reliability products and comprehensive services to global customers.

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